CONNECT European Moldflow User Meeting
Save the Date – 15. and 16. June 2026

Film Insert Molding (FIM) represents a key technology for integrating decorated films into injection molded parts, enabling high-quality decorative and functional surfaces. 

A significant challenge in FIM processes is ink washout, which can result in substantial scrap rates and development costs. 

This study presents a novel simulation approach for predicting ink washout phenomena during the FIM process, specifically focusing on Polycarbonate films with black screen-printed designs. The methodology integrates a custom developed Moldflow® API to simulate the interaction between the injected thermoplastic melt and the printed film surface. 

Initial validation tests were conducted using Covestro Makrofol® films. The simulation method enables proactive mold/gate design optimization, potentially eliminating ink washout issues before physical production begins. This advancement represents a significant step forward in FIM process optimization and quality assurance. 

Discover how Yanfeng has integrated Autodesk Moldflow into its workflow—from RFQ to production—optimizing processes, improving part quality, and creating the link between simulation and real-world manufacturing. Our approach supports better project execution and continuous improvement in manufacturing performance.

Flash defect, an undesirable excess material formation at the interface of mold cavities, poses significant challenges in manufacturing processes by compromising product quality and increasing production costs. To address this issue, we carried out numerical simulations using Autodesk® Moldflow® to model the injection molding process and predict the occurrence of flash defects under various operating conditions. These simulation results are then compared with experimental findings obtained from physical molding trials. This allowed us to evaluate the effectiveness and accuracy of the simulations. By systematically analyzing the deviations between simulation results and experimental data, insights into the underlying mechanisms of flash formation and factors influencing its occurrence are gained. Guidelines for effective simulation flash formation are also extracted as a result of the investigation. After validating the accuracy of the simulation results with experiments, the model can be used to generate a simulated dataset which essential to train AI-based algorithms for much faster and cost-effective predictions.

At the CONNECT Moldflow User Meeting, Hanno van Raalte will present what’s new in Autodesk® Moldflow® 2026, including key enhancements such as improved solver performance, default activation of the STAMP warpage model for 3D meshes, and new export capabilities like MP4 animation. These updates aim to streamline workflows and improve result accuracy. Franco Costa will provide an R&D outlook on the future of Moldflow, highlighting upcoming developments in cooling optimization, advanced valve gate control, and improved simulations for overmolding and injection compression molding. Together, these sessions offer valuable insights into the current and future direction of Moldflow technology.